We love challenges
We specialize in production of raw and populated printed circuit boards with a focus on speciality boards often found in military and aerospace applications. These products require US manufacturing and often engineering and design support to ensure a quality design.
Our board manufacturing partners are world class, adding new equipment and processes on a regular basis. We offer three mil traces and spaces, multilayer PCB’s 2-30+ layers, controlled impedance, stacked Microvias, via-filling, flex, and a wide variety of surface finishes (many of which are RoHS compliant) and a wide variety of base materials with UL approval, bromine-free, and high Tg.
Typical challenges
- High temperature or high reliability applications
- Telecom or RF PCB
- Rigid-Flex or Flex requirements
- Turnkey box-build assembly (electrical and mechanical)
- Prototype or low-volume circuit board production
Challenging printed circuit board manufacturing
Manufacturing
Manufacturing
Manufacturing
- Bookbinder Circuits
- Controlled Impedance
- High frequency Applications
- Heavy Metals
- Heat Sinks and Metal Cores
- Blind and Buried Vias
- Micro Vias – Epoxy or Copper Filled
- Multiple Surface Finishes
- Wide Range of Substrate Materials up to 30 layers
- Burn-In and ESS
- In-Circuit Reliability
- X-Ray & Repair Station for BGA
- Panel sizes up to 18×24″ are typically used, however, we can go with larger panel sizes for special applications.
- 30+ layers
- IPC-6013 class 3 for high reliability commercial and military/aerospace flexible circuit boardapplications
- PC-6012 Class 3, and 3A for the most stringent rigid PCB needs.
- MIL-PRF-31032, MIL-P-50884, and MIL-PRF-55110
- Box build and turnkey assembly
Quality
Manufacturing
Manufacturing
- New Product Introduction
- Regulatory Testing and Compliance Support
- Material Management program
- ISO 9001:2000
- ISO 14001
- AS9100D
- Mil spec soldering and assembly
- UL & CE certification
- FDA certification