We love challenges

We specialize in production of raw and populated printed circuit boards with a focus on speciality boards often found in military and aerospace applications.  These products require US manufacturing and often engineering and design support to ensure a quality design.

Our board manufacturing partners are world class, adding new equipment and processes on a regular basis.  We offer three mil traces and spaces, multilayer PCB’s 2-30+ layers, controlled impedance, stacked Microvias, via-filling, flex, and a wide variety of surface finishes (many of which are RoHS compliant) and a wide variety of base materials with UL approval, bromine-free, and high Tg.


Typical challenges

  • High temperature or high reliability applications
  • Telecom or RF PCB
  • Rigid-Flex or Flex requirements
  • Turnkey box-build assembly (electrical and mechanical)
  • Prototype or low-volume circuit board production

Challenging printed circuit board manufacturing




Chemcut SES line

  • Bookbinder Circuits
  • Controlled Impedance
  • High frequency Applications
  • Heavy Metals
  • Heat Sinks and Metal Cores
  • Blind and Buried Vias
  • Micro Vias – Epoxy or Copper Filled
  • Multiple Surface Finishes
  • Wide Range of Substrate Materials up to 30 layers
  • Burn-In and ESS
  • In-Circuit Reliability
  • X-Ray & Repair Station for BGA
  • Panel sizes up to 18×24″ are typically used, however, we can go with larger panel sizes for special applications.
  • 30+ layers
  • IPC-6013 class 3 for high reliability commercial and military/aerospace flexible circuit boardapplications
  • PC-6012 Class 3, and 3A for the most stringent rigid PCB needs.
  • MIL-PRF-31032, MIL-P-50884, and MIL-PRF-55110
  • Box build and turnkey assembly




Emma flying probe tester

  • New Product Introduction
  • Regulatory Testing and Compliance Support
  • Material Management program
  • ISO 9001:2000
  • ISO 14001
  • AS9100D
  • Mil spec soldering and assembly
  • UL & CE certification
  • FDA certification